The so-called spray of tin is to soak the circuit board into the molten tin-lead. After the surface of the circuit board is covered with enough tin and lead, the hot air is used to pressurize the excess tin and lead. After tin-lead cooling, the soldered areas of the board will be covered with tin and lead of appropriate thickness. This is the outline of the process for the soldering process.
There are two parts to the general tin sprayer's solution. One part is that the circuit board will be coated with a layer of flux beforehand. The main function is to help tin and lead adhere to the surface of the circuit board. The other one should not be called As a solution, and generally referred to as oil, we generally call it antioxidant oil in the industry.
The main function is to promote the uniform heat transfer on the surface of the circuit board, and to prevent the residual solder from picking up the circuit board solder stop area. In addition it also has the function of slowing the oxidation of tin and lead. The general flux should be called Flux. This is a rough description for your reference.
There are two parts to the general tin sprayer's solution. One part is that the circuit board will be coated with a layer of flux beforehand. The main function is to help tin and lead adhere to the surface of the circuit board. The other one should not be called As a solution, and generally referred to as oil, we generally call it antioxidant oil in the industry.
The main function is to promote the uniform heat transfer on the surface of the circuit board, and to prevent the residual solder from picking up the circuit board solder stop area. In addition it also has the function of slowing the oxidation of tin and lead. The general flux should be called Flux. This is a rough description for your reference.
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