Integrated Circuits Used for Bonded Aluminum Wire Project won Tianjin Science and Technology Progress Award

The “High-strength Ultrafine Bonded Aluminum Wires for ICs” project, which was listed in the Tianjin Key Supported Patent Product Catalog, passed the municipal acceptance and scientific and technological achievements appraisal. The production technology reached the international advanced level and won the 2007 in Tianjin City. Science and Technology Progress Award. Tianjin Shixing Electronic Materials Co., Ltd. developed integrated circuits using bonded aluminum wires and made of 1% silicon-containing aluminum-silicon alloy wire rods by solid solution treatment, cryogenic treatment, rough drawing, fine drawing, and finished single wire annealing. And through the independent innovation of die-less continuous casting technology, low temperature large processing rate of stretching technology, so that the length of bonded aluminum monofilament reached 10,000 meters or more, the production efficiency has been greatly improved, with an annual output capacity of more than 450,000 kilometers. At the same time, its excellent physical and chemical properties of the product, the interrupt line rate in the packaging process is very low, to meet the requirements of the new high-speed automatic ultrasonic welding machine operation, so that it has significant economic and social benefits.